Datacon 2200 evo manual

The Datacon EVO high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for Flip Chip applications. Equipped with integrated dispenser, 12' wafer handling, automatic tool changer and application specific tooling, the Datacon EVO is prepared for present and future processes and products. www.doorway.ru › Datacon Evo Manual. evo evo plus. -Film Foil In Development Next generation Die Attach •Next generation Packaging •Common modules Datacon Datacon Fico Meco Fico New 8 Fico. •Besi has full range of AP systems. E revenue: 70% substrate/wafer level vs. 30% leadframe. The Datacon evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon evo is prepared for present and future processes and products.

Datacon EVO for auction. SN: Wrapped in Storage Room Cell + Diode Attach VAC, KVA, 3 PH 6 bar, 20 L/Min bar Nm3/Hr 1 bar, 1 L/min - lbs. 84" W x " D x " H. Datacon Bonder (Flip Chip demo). Die Bonder Manual. Tresky / Detail. Die Bonder Semi Auto. Amadyne SAM42 Detail. Hybrid Die Bonder. Datacon EVO Detail. Wedge Bonder. FK Delvotec G5/ Detail. Wire Bonder. Hesse BJ Datacon EVO Detail. Wedge Bonder. FK Delvotec G5/ Detail. Welcome to CMTec - Your #1 Used Semiconductor Equipment Partner.

Datacon evoplus Innovative Solution for Innovative Products Future Proof Equipment s The Datacon evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full. Manual flip-chip bonding high accuracy Datacon EVO Initialization. Datacon evo plus Die placement temperature This manual system is the perfect so-. Consult BE Semiconductor Industries's evo brochure on DirectIndustry. Subscribe Subscribed Unsubscribe 0 0. Datacon EVO Bond Head Auto Calibration. Accuracy Flexibility for your mass production. The new Datacon evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of www.doorway.ru an all new gantry controller system as well as a completely new vision and camera generation Datacon evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and.